ABOUT

The 2026 International Symposium on Computational Intelligence and Innovative Applications (CIIA2026) provides an opportunity for experts, researchers, and developers to meet and discuss recent research results, new developments and new concepts on Computational Intelligence and Innovative Applications. The purpose of the symposium is to create a forum for global scientists to share knowledge and establish international research collaborations in their careers. At the symposium, researchers will not only be able to share their new ideas and solutions to solve problems relating to Computational Intelligence and Innovative Applications, but also identify new problems and research directions for related research and development in the future.

IMPORTANT DATES

Abstract submission:                            

February 5, 2026

Full Paper submission:                            

May 2, 2026

Acceptance notification:                  

September 1, 2026

Registration:                                    

September 11, 2026

Camera-Ready:                                

September 30, 2026

Conference Date:                             

October 8 - 10, 2026

KEYNOTE SPEAKERS

TOPICS

Conference invites original submissions in a wide range of topics, including but not limited to the following:

• Power electronics; Automation; Control Engineering; Smart Grids; Energy Storage; Renewable Energy; Power System.
• Electronics and Telecommunication.
• Communication computer network; Artificial intelligence; Intelligent Systems; Cyber–Physical Systems and Smart Devices; Privacy, and Trustworthy Computing; Robotics, Mechatronics, and Smart Manufacturing.
• Internet of Things; Semiconductor and Integrated Circuit Technologies; Embedded System and Edge AI.

SUBMISSION

Papers for CIIA 2026 should be submitted electronically through the online submission platform:
https://conf.iuh.edu.vn/index.php/ysc2025/submission
and will be reviewed by experts in the fields and ranked based on the criteria of significance, quality and clarity.

     PUBLICATION

• TBC

ORGANIZATIONS AND SPONSORS

Industrial University of Ho Chi Minh City, Vietnam

HCMC Department of Science and Technology, Vietnam

University of Liège (Belgium)

GENERAL CHAIRS

TBC

PROGRAM COMMITTEE CHAIRS

TBC

STEERING COMMITTEE

TBC

PROGRAM COMMITTEE

TBC

LOCAL ORGANIZING COMMITTEE

TBC

CONTACT

Industrial University of Ho Chi Minh City

Office of Science Management & International Affairs

Website: https://smia.iuh.edu.vn/

Director:  Assoc. Prof., TRINH NGOC NAM, Ph.D.

     TEL: 0283.8940 390 (Ext 113)

     Email: trinhngocnam@iuh.edu.vn